HPE’s New 'Helios' AI Rack Unveils Breakthrough Scale for Trillion-Parameter Models
Hewlett Packard Enterprise (HPE) has unveiled the first AMD "Helios" AI rack-scale architecture with a built-in, open Ethernet-based networking solution powered by Broadcom’s technology. Set to be available globally in 2026, this release positions HPE among the leaders providing AI compute platforms that deliver unprecedented scale and flexibility for cloud service providers.
Purpose-Built Architecture Delivers Industry-Leading Performance
The HPE Helios rack brings together 72 AMD Instinct MI455X GPUs per rack and leverages an advanced, liquid-cooled, open-standards design. What sets this architecture apart is its remarkable combination of bandwidth and compute power—supporting trillion-parameter AI model training and high-throughput inference on a single, turnkey platform. Specifically, the system delivers 260 terabytes per second of scale-up bandwidth and an astonishing 2.9 exaflops of FP4 AI performance. Backing these numbers are 31 terabytes of high bandwidth memory (HBM4) and 1.4 petabytes per second of memory bandwidth—enabling seamless data flow for today’s most demanding AI and high-performance computing workloads.
| Key Feature | Helios AI Rack Specs |
|---|---|
| GPU Count (Per Rack) | 72 AMD Instinct MI455X |
| Aggregate Bandwidth | 260 TB/s |
| Peak AI Performance | 2.9 Exaflops (FP4) |
| High Bandwidth Memory (HBM4) | 31 TB |
| Memory Bandwidth | 1.4 PB/s |
Open, Scale-Up Networking: Lower Costs, Less Vendor Lock-In
HPE’s collaboration with Broadcom yields the first standards-based, Ethernet scale-up switch built for rack-level AI training and inference workloads. Using Broadcom’s Tomahawk 6 chip and the Ultra Accelerator Link over Ethernet (UALoE) standard, this network layer is designed for high performance and ease of deployment. The approach not only delivers ultra-low latency and lossless networking for large-scale models but also sidesteps proprietary hardware—minimizing vendor lock-in and maximizing customer flexibility.
Further, the architecture aligns with Open Compute Project (OCP) specifications, employing practical features such as advanced power delivery, liquid cooling, and robust serviceability—critical for next-gen AI infrastructure. Integration with open source AMD ROCm software and AMD Pensando networking helps streamline operations and reduces total cost of ownership.
Designed for Fast, Efficient AI Rollouts
The AMD Helios platform comes as a complete package delivered by HPE’s seasoned services team, with extensive experience in direct liquid cooling and exascale installations. The goal: accelerate AI deployment cycles for CSPs and enterprise customers amid soaring global demand for compute capacity. By prioritizing open standards and network automation, HPE’s solution helps ensure rapid scaling, efficient operations, and a future-ready path for emerging AI workloads.
Implications for the AI Infrastructure Market
With cloud and AI service providers facing surging demand for model training at unprecedented scale, the HPE Helios solution stands out for its blend of performance, energy efficiency, and ease of integration. Leveraging industry partnerships and open, standards-driven technology, HPE’s new rack architecture not only raises the bar for AI data center design but may also shape industry norms for scalable, interoperable AI computing over the coming years.
What to Watch For
HPE’s rollout of the AMD Helios AI rack in 2026 signals a shift towards open networking standards, robust scalability, and rapid deployment as competitive necessities in the evolving AI infrastructure space. With Broadcom and AMD on board, industry observers will be keen to see how quickly cloud service providers adopt these new architectures—and how this impacts the future landscape of large-scale AI deployments worldwide.
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