Sei High Yield Bond & Alternative Credit ETF's next ex-dividend date is projected to be between 3-Sep - 4-Sep. The next dividend for LEND is projected to be between 0.0893 - 0.1931.
About LEND's dividend:
Number of times Sei High Yield Bond & Alternative Credit ETF has decreased the dividend in the last 3 years: 1
The trailing 12 month dividend yield for LEND is: 1.6%
