Helios Ushers in Open, Scalable AI Infrastructure for Modern Workloads
AMD and HPE have taken a significant step forward in high-performance AI by introducing the ‘Helios’ rack-scale AI platform—designed as an open, full-stack solution for large-scale artificial intelligence clusters. By blending AMD’s leadership compute technologies with HPE’s system innovations and collaboration from Broadcom, the companies are seeking to accelerate cloud, research, and enterprise adoption of efficient and flexible AI infrastructure.
2.9 ExaFLOPS per Rack: Industry-Leading Performance for Demanding AI and HPC Applications
At the core of ‘Helios’ is a unified architecture featuring next-gen AMD EPYC™ “Venice” CPUs, AMD Instinct™ MI455X GPUs, and AMD Pensando™ Vulcano NICs, all brought together through the open ROCm™ software ecosystem. The result? Up to 2.9 exaFLOPS of FP4 performance per rack—enabling organizations to build AI clusters with extraordinary scalability, flexibility, and performance.
This powerful stack is designed on the OCP Open Rack Wide specification, allowing for simplified deployment and streamlined scalability, particularly suited for rapidly evolving AI research and commercial needs.
| Key Helios Platform Features | Specification / Partner |
|---|---|
| Compute | AMD EPYC "Venice" CPUs & Instinct MI455X GPUs |
| Performance | Up to 2.9 exaFLOPS (FP4) per rack |
| Networking | HPE Juniper/Broadcom switches; Pensando Vulcano NICs |
| Software Stack | ROCm (open ecosystem) |
| Availability | Global rollout via HPE in 2026 |
Next-Gen Networking: Low-Latency, High-Bandwidth Fabric Powered by Broadcom and HPE Juniper
The platform integrates purpose-built HPE Juniper Networking switches developed in partnership with Broadcom. These deliver Ultra Accelerator Link over Ethernet (UALoE) connectivity for high-throughput, low-latency links—a crucial factor in the performance of massive AI clusters. This network layer not only boosts speed but also embraces open, standards-based innovation.
Supercomputing in Europe: Herder Set to Advance AI and HPC Research
The Helios initiative goes beyond the datacenter. Herder—a supercomputer scheduled to enter service at Germany’s HLRS in 2027—will combine AMD Instinct MI430X GPUs and EPYC "Venice" CPUs within HPE’s Cray GX5000 platform. The goal: support Europe’s sovereign AI ambitions and advance hybrid AI/HPC workflows for researchers and industry alike. This partnership gives European users a tool for larger simulations and new algorithmic advances, positioning the continent at the cutting edge of scientific and industrial computing.
| Herder Supercomputer Specs | Details |
|---|---|
| Platform | HPE Cray GX5000 |
| Compute | AMD Instinct MI430X GPUs + EPYC "Venice" CPUs |
| Commission Date | End of 2027 (delivery: 2H 2027) |
| Purpose | Hybrid AI/HPC research for science and industry in Europe |
Industry Context: Commitment to Open, High-Performance Computing Drives Flexibility and Speed
This expanded partnership underscores AMD and HPE’s decade-long collaboration and their shared commitment to open standards in the race for AI innovation. For businesses and researchers facing growing data complexity and time-to-solution pressures, platforms like Helios represent an opportunity to accelerate results without the lock-in and inflexibility of proprietary systems.
What to Watch: Global Rollout and Supercomputer Launch Set for 2026–2027
Looking ahead, the AMD Helios architecture will become globally available via HPE in 2026, with Europe’s Herder supercomputer to follow by end-2027. While the press release contains forward-looking statements and inherent industry risks, the move signals a major leap in the availability and performance of AI and high-performance computing at scale. Investors, enterprises, and researchers alike may find this collaboration an indicator of where the next phase of infrastructure innovation is heading.
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