STMicroelectronics (NYSE:STM) disclosed further elements of its program to reshape its global manufacturing footprint. This program builds on the one the company announced in October 2024 to strengthen its competitiveness.

CEO Jean-Marc Chéry said the technology R&D, design, and high-volume manufacturing activities in Italy and France will remain central to its global operations.

Tesla, Inc. (NASDAQ:TSLA) and Apple Inc. (NASDAQ:AAPL) supplier STMicroelectronics’ manufacturing operations aim to prioritize planned investments in future-ready infrastructure, such as 300mm silicon and 200mm silicon carbide wafer fabs.

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STMicroelectronics plans to continue investing in upgrading the technology used across its operations, deploying additional AI and automation to improve efficiency in technology R&D and manufacturing.

Over the next three years, the reshaping of STMicroelectronics’ manufacturing footprint will design and strengthen its complementary ecosystem: in France around digital technologies, in Italy around analog and power technologies, and in Singapore on mature technologies.

STMicroelectronics plans to double the current capacity of the Agrate (Italy) 300mm fab to 4,000 wafers per week (wpw) by 2027, with ...

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