Taiwan Semiconductor Preps New Chip Tech To Supercharge AI Performance By 2027
Benzinga (Tue, 15-Apr 10:20 AM)
Taiwan Semiconductor Manufacturing Co (NYSE:TSM) is close to finalizing the specifications for a new approach to chip packaging that will meet the demand for more powerful artificial intelligence chips.
The Taiwanese contract chipmaker plans to start small production volumes around 2027, Nikkei Asia reported Tuesday.
Taiwan Semiconductor’s new technology, known as “panel-level” advanced chip packaging, will use a square substrate to accommodate more semiconductors and thus boost computing performance versus the usual 300-millimeter round wafers.
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