Power Integrations Unveils Industry-First 1250 V & 1700 V GaN Technology for 800 VDC AI Data Centers
Breakthrough GaN Technology Targets 800 VDC Data Centers—Collaboration with NVIDIA
Power Integrations is reshaping the AI data center landscape, introducing the first 1250 V and 1700 V PowiGaN™ switches specifically designed for the demands of next-generation 800 VDC data centers. Through a white paper released at the OCP Global Summit—and with direct collaboration from NVIDIA—the company has demonstrated that its technology offers higher efficiency, power density, and reliability compared to existing solutions.
Performance Gains Highlighted: 1250 V PowiGaN HEMTs Surpass Legacy Devices
According to Power Integrations, a single 1250 V PowiGaN switch not only exceeds the performance of stacked 650 V GaN FETs, but also outpaces competing 1200 V SiC devices. The key metrics: efficiency greater than 98% for the 800 VDC architecture, and a significant improvement in power density, helping address the rapid scaling of rack power for AI workloads. The reliability of PowiGaN switches has also been field-proven, with over 175 million units shipped since the technology’s 2018 launch.
| Feature | Power Integrations (POWI) Solution | Competitor GaN | 1200 V SiC |
|---|---|---|---|
| Switching Voltage (V) | 1250 V & 1700 V PowiGaN | 650 V | 1200 V |
| Efficiency (%) | >98 | Lower | Lower |
| Field Deployment | >175M units | Limited | Growing |
| Target Architecture | 800 VDC (AI Data Center) | Lower Voltage Racks | Mixed |
System-Wide Benefits: Power Density and Auxiliary Supply Efficiency Rise
The PowiGaN portfolio isn't just about the main switch. The InnoMux™2-EP IC leverages an integrated 1700 V PowiGaN switch, providing auxiliary power supply efficiency of more than 90.3% in demanding, liquid-cooled and fanless 800 VDC racks. For data centers pursuing both higher density and reduced cooling needs, this can mean significant cost and operational benefits.
Strategic Collaboration: NVIDIA Partnership and Industry Direction
NVIDIA’s update at the OCP Global Summit and partnership with Power Integrations further legitimizes the industry shift toward 800 VDC power for large-scale AI data centers. The new architecture reduces copper use, simplifies rack design, and enables more efficient scaling as power demands surge. Power Integrations is the only supplier currently offering these high-voltage GaN switches at production scale, underscoring its technology lead.
What’s Next: The Transition to 800 VDC Architectures Accelerates
As data center rack power continues its rapid climb, solutions like Power Integrations’ 1250 V and 1700 V PowiGaN devices could become foundational to the future of AI infrastructure. With more than 175 million GaN switches in active deployment and direct engagement from hyperscalers, this technological leap may soon set new efficiency and design benchmarks across the sector.
For those tracking innovation in data center power, now is a critical time to follow the developments around high-voltage GaN solutions and the shift to 800 VDC architectures—particularly as NVIDIA and other major players weigh in on next-gen designs.
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